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NTLUS3A18PZ
Power MOSFET
? 20 V, ? 8.2 A, Single P ? Channel,
2.0x2.0x0.55 mm m Cool t UDFN Package
Features
? UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
? Low Profile UDFN 2.0x2.0x0.55 mm for Board Space Saving
? Ultra Low R DS(on)
? ESD Diode ? Protected Gate
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? Optimized for Power Management Applications for Portable
Products, such as Cell Phones, Media Tablets, PMP, DSC, GPS, and
Others
? Battery Switch
? High Side Load Switch
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
? 20 V
G
http://onsemi.com
MOSFET
R DS(on) MAX
18 m W @ ? 4.5 V
25 m W @ ? 2.5 V
50 m W @ ? 1.8 V
90 m W @ ? 1.5 V
D
I D MAX
? 8.2 A
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Symbol
V DSS
V GS
Value
? 20
± 8.0
Unit
V
V
Continuous Drain
Current (Note 1)
Continuous Drain
Current (Note 1)
Steady
State
t ≤ 5s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
? 8.2
? 5.9
? 12.2
A
S
P ? Channel MOSFET
1
AC M G
CASE 517BG G
Power Dissipa- Steady
tion (Note 1) State
t ≤ 5s
Continuous Drain Steady
Current (Note 2) State
Power Dissipation (Note 2)
Pulsed Drain Current
Operating Junction and Storage
Temperature
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
tp = 10 m s
P D
I D
P D
I DM
T J ,
T STG
1.7
3.8
? 5.1
? 3.7
0.7
? 25
-55 to
150
W
A
W
A
° C
S MARKING DIAGRAM
D
UDFN6
( m COOL ] )
Pin 1
AC = Specific Device Code
M = Date Code
G = Pb ? Free Package
(*Note: Microdot may be in either location)
PIN CONNECTIONS
ESD (HBM, JESD22 ? A114)
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
V ESD
I S
T L
2000
? 1.7
260
V
A
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm 2 , 2 oz. Cu.
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2012
July, 2012 ? Rev. 3
1
Publication Order Number:
NTLUS3A18PZ/D
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